We will present a paper (collaborative work with Denka (Japan) and CMT Corp. (Rep. of Korea)) at the 2026 IEEE 76th Electronic Components and Technology Conference held in Orlando, Florida during May 26-29, 2026 as follows;
Title : Enhancement of Thermal Conductivity of the Advanced Packaging Materials by Using BNNT
Session 9 : Advances in Thermal Materials and Encapsulation
Date and Time : May 26 (Wed) 2:00PM
This paper is strongly focused on the advanced packaging filler based on BNNT coated ceramic clusters powder, which will increase thermal conductivity while processing viscosity increase minimized, and material properties such as CTE and mechanical strength enhanced as well. We will continue developing our BNNT technologies in various industrial sectors including semiconductor packaging materials uisng the BNNT coated ceramic clusters fillers, aerospace engineering, energy and environment, sensors for AI robotics, etc. based on our mass BNNT production technology.
2026 ectc home.jpg
naieel prepenstation.jpg
